Precision Vaccum Chucks

 

Applied for for semiconductor lithography equipment

Features:

- High precision: flatness of 0.2 μm with L/F of not more than 0.05 μm

- Shape control: adjustable chuck shapes in accordance with the shapes of wafers (unevenness control)

- Absorption responsiveness: customized planar design following specifications

- Quantitative and Qualitative Analysis: Yeedex(RSM)